Qualcomm Robotics RB3 Platform (SDA845)
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- 高通机器人开发平台
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采用搭载异构计算架构高通SDA845处理器的DragonBoard 845C作为主板的机器人开发套件。
它集成了高达 2.8GHz/八核的 Qualcomm Kryo CPU、Qualcomm Adreno 630 GPU 和 Qualcomm Hexagon 685 DSP。
它支持 Linux 和 ROS，还支持高通神经处理 SDK、高通计算机视觉套件、高通 Hexagon DSP SDK 和用于设备端 AI 的 AWS RoboMaker。
它具有高能效，适用于从大型工业机器人到小型电池供电机器人的各种机器人开发。
- 产品负责人
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姓名：刘工
电话：13381615204（同微信）
邮箱：sales@yixinkeyan.com
微信：扫描二维码添加
产品型号
| 产品名称 | 型号 | 货期 | 单价 |
|---|---|---|---|
| Qualcomm Robotics RB3 Development Basic Kit | 开发基础套件 | 2-4周 | 学术折扣价 |
目前产品均为在售中，如果您对产品的规格参数、报价、货期等信息有任何问题，请随时和我们或者产品负责人联系，我们将在收到您的询问信息后第一时间给您回复。
产品描述
套件内容：
Robotics DragonBoard™ 845c development board featuring Qualcomm® SDA/SDM845 processor and compliant with the 96Boards open hardware specification
Qualcomm Robotics navigation mezzanine featuring time-of-flight, tracking camera, active stereo camera and main camera, which is compliant with 96Boards open hardware specification
Sensor support including the industry’s best performing ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor from TDK InvenSense
Qualcomm Robotics cellular mezzanine (可选)
Multi-Mic support
Power supply
规格参数：
SoC : Qualcomm SDA845
CPU : SDA845 8x Kryo 385 CPU, up to 2.8 GHz
GPU : Qualcomm Adreno 630 GPU with support for Open GL ES 3.2 and Open CL 2.0
DSP : Qualcomm Hexagon 685 DSP with 3rd Gen Vector Extensions
ISP : Qualcomm Spectra 280 Image Signal Processor with new architecture for 14-bit image signal processing
RAM : 4GB LPDDR4x SDRAM @ 1866 MHz
Memory : LPDDR4x, 4x16 bit; up to 1866MHz, 4GB RAM
Storage : 64GB UFS 2.1 on-board storage and 1 x MicroSD card slot
Ethernet : 1x GbE Ethernet
Wireless :
- Wi-Fi integrated 802.11ac 2x2 with MU-MIMO; Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual Band Simultaneous (DBS).
- Qualcomm TrueWireless Bluetooth 5.0
Location : GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
USB :
- 1 x USB 2.0 Micro B (Debug only)
- 1 x USB 3.0 Type C (OTG mode)
- 2x USB 3.0 Type A (Host mode only)
Display :
- Two 4-lane DSI, D-PHY 1.2 or C-PHY 1.0; VESA DSC 1.1
- 1 x HDMI 1.4 (Type A - full) connector
Video : Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut; H.264 (AVC), H.265 (HEVC) and VP9 support; Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
Audio : MP3; aacPlus, eAAC; WMA 9/Pro
Camera : Single HFR 16 MPix camera at 60fps ZSL, Dual 16 MPix cameras at 30fps ZSL, Single 32 MPix camera at 30fps ZSL
Sensor : ICM-42688 6-Axis High Performance Motion Sensor, ICS-41351 Top Port Digital Microphone, and ICP-10101 Barometric Pressure Sensor from TDK InvenSense.
Expansion Interfaces : 2 x 60 pin High-Speed connectors , 2 x 40 pin Low-Speed connectors, 1 x 20 pin Low-Speed connector
LED : 7 x LED indicators
Button : Power ,Volume Up/Down,Force Usb Boot, DIP Switch
Power Source : 12V@2.5A adapter with a DC plug
OS Support : LE
Size : 85mm by 54 mm
产品图片：
